This research report describes a set of mathematical equations and a C program which may be used to determine whether or not C4 solder pads with a given height, diameter, and pad spacing can be inspected using the Oblique Viewing Microscope (OVM). The OVM is the optical front end for both the Pad Analysis System (PAS) and the Individual Chip Inspection System (ICIS). PAS and lClS are used to detect low volume C4 solder pads on wafers and diced chips before the chips are joined to the substrate.
By: K. B. Kirtley
Published in: RC18830 in 1993
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